Quality Control

KEY-Components know there are many fake parts in the all electronics supply chain, which would have caused serious issues and bad consequences for customers. Therefore, we strongly request to control the quality of each product must be safe and reliable, new and original before shipment.

Part Test Process By KEY-Components

HD Visual Inspection
HD Visual Inspection
High Definition Appearance testing including silk screen, coding, High Definition detect solder balls, which can detect whether oxidized or counterfeit parts.
Final Function Testing
Final Function Testing
During a functional test the voltage level of the output signals from the DUT are compared to the VOL and VOH reference levels by the functional comparators. An output strobe is assigned a timing value for each output pin to control the exact point within the test cycle for sampling the output voltage.
Open/Short Test
Open/Short Test
The opens/shorts test(also called continuity or contact test) verifies that, during a device test, electrical contact is made to all signal pins on the DUT and that no signal pin is shorted to another signal pin or power/ground.
Programming Function Testing
Programming Function Testing
To exam the read, erase and program function as well as blank checking for chips including digtal memory, Microcontrollers, MCU and so on.
X-RAY And ROHS Test
X-RAY And ROHS Test
X-RAY can confirm whether the wafer and wire bond and die bond is good or not; the ROHS test is via the environmental protection of the product pin and lead content of the solder coating by the photovoltaic equipment.
Chemistry Analysis
Chemistry Analysis
Verify by chemical analysis whether the part is fake or refurbished.
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